TEXPO

Data Centre Telecommunication Bonding Assessment

TEXPO is a world-class developer and provider of physical infrastructure solutions that help customers improve operational efficiency, availability, and business agility. In today’s world of specialization and complexity, you need a trusted partner to work with you to mitigate risks and drive improved performance. Working with our business partners, TEXPO Professional Services now fills that role by providing a full range of physical layer services based on our Unified Physical Infrastructure SM (UPI) approach. These services help you assess, design, and maintain resilient, sustainable solutions for your physical infrastructure.

Poorly designed or improperly applied bonding can result in injury to your employees, damage to your expensive equipment, and poor network performance. The TEXPO Bonding Assessment helps you design and implement an effective bonding network that provides comprehensive protection for your personnel and equipment, maximizes your network uptime, and maintains system performance. This assessment examines your facility’s current bonding system and practices, evaluates their compliance with industry standards and best practices, and recommends measures that will bring your facility’s bonding into compliance.

Features	Benefits
Visual inspection of bonding and quantified measurements of current and resistance	Validates the effectiveness of your bonding connections and network
Analysis of the bonding of equipment, racks and cabinets, and supplemental bonding network topology	Provides a comprehensive examination, measurement, and evaluation of your telecommunications bonding system; identifies areas of concern and opportunities for improvement
Recommendations for improving the existing bonding network	Provides options for the remediation of your bonding system to meet industry standards and best practices

TEXPO will provide you the following services under this assessment

Bonding Inspection

• Discuss specific issues driving the assessment (equipment failures, poor network performance, etc.)
• Document information and photograph items relevant to the telecommunications bonding network installation
• Visually inspect all racks and cabinets in the facility; verify the presence of electrostatic discharge (ESD) wrist straps and bonds between active equipment and the racks/cabinets, sections of the racks and cabinets, bonds between the racks/cabinets and the

Telecommunication Grounding Busbar (TGB)

• Measure and document AC and DC currents at the telecommunications grounding busbars
• Measure and document DC resistances across equipment that is part of the Ethernet network (excluding telephone company equipment)
• Measure and record resistances of a representative sampling of rack/cabinet structural members, resistances between active equipment and the Telecommunications Equipment Bonding Conductor (TEBC), and resistances of a representative sampling of shielded cables and the TEBC

Report/Recommendations

• Generate a baseline assessment of the bonding integrity of the telecommunications installation
• Provide a comprehensive report indicating conditions that compromise bonding effectiveness and provide commendations on how to improve the performance to established industry standards

Best Practice Installation Advice

• Recommendations for best practice installation techniques that meet the intent of the design standards (IEEE Std. 1100, TIA-942, J-STD-607-A) for future telecommunication bonding system expansion
• Recommendations for supplemental return path(s) for electrical transients
• Recommendations for Electrical Potential Equalization